TSMC plans 450mm wafers by 2018

The 450mm wafers would help solve the problem of rising costs in making advanced chips, allowing TSMC to provide affordable 10 nanometer chips with FinFET transistors for customers, J.K. Wang (王建光), vice president of TSMC’s operation in charge of 300mm factories, told a media briefing arranged by semiconductor industry association SEMI.

via TSMC plans 450mm wafers by 2018 – Taipei Times.

Chipmakers can get 2.5 times more chips from a 450mm wafer than from a 300mm wafer.