New manufacturing technology enables vertical 3D NAND transistors, higher capacity SSDs

According to the folks at Applied Materials, trying to build 3D NAND structures in real life would be like trying to dig a one-kilometer-deep, three-kilometer-long trench with walls exactly three meters apart, through interleaved rock strata — and that’s before we discuss gate trenches or the staircases. Conventional etching systems deal with aspect ratios of 3:1 – 4:1, 3D etching requires an aspect ratio of 20:1 or more — and that’s not easy to pull off.

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