The technique involves cutting microfluidic channels into the die of FPGA devices, which were chosen for the research and trials because of their flexible configuration and extensive use in the military. Effectively this locates the cooling just microns from the problem, and even allows for the possibility of chip-stacking, which very few devices currently have the room or efficiency to achieve, given the necessity to dissipate heat from a central locus of adjacent chips.

Source: On-chip liquid cooling promises revolutionary change